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The following is an archive of recent Teseda news items and press releases.

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Teseda Corporation Launches and Ships SecureXY™

Second Product Offering in the Diagnostic Manager Tool Suite

Portland, Ore. — July 16, 2007 — Teseda Corporation, a leading provider of comprehensive scan-based diagnostic and debug solutions for high yield silicon production, is now shipping the SecureXY™ product. SecureXY™, a powerful yield-enhancement tool, enables the sharing and analysis of pertinent failure information in the physical domain without compromising the design IP.

SecureXY™ works in conjunction with ScanXY™, the first tool in the Diagnostic Manager Suite. ScanXY™ takes scan failure information and design information and is able to present failure data in a Physical die view showing failing scan cells, failing scan chains, and XY location data. SecureXY™ is able to take the ScanXY™ data, and present it as an XY view while protecting sensitive design IP information

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Teseda Corporation Launches ScanXY™

First Phase of the Diagnostic Manager Series Product Group

Portland, Ore. — June 25, 2007 — Teseda Corporation, a leading provider of comprehensive scan-based diagnostic and debug solutions for high yield silicon production, is pleased to announce ScanXY™, the first in the Teseda Diagnostic Manager Series software products. After its initial release to key customers, ScanXY™ is now available to the general market.

ScanXY™ allows engineers to quickly link structural test data mismatches to their physical domains. The viewing capabilities of ScanXY™ show the XY location where test failures and subsequent "hot spots" are taking place. ScanXY™ runs without third party intervention, either independently or in conjunction with the Teseda WorkBench™ (TWB) software.

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Spotlight
Teseda and Mentor Graphics Partner to Speed Defect Diagnosis
YieldAssist and Teseda platform linked to provide iterative diagnosis environment.
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Ramp Yield quickly with Teseda’s Diagnostic Manager Suite


In order to first ramp, then ensure stable production and high yield of today’s semiconductor technology, it is necessary to thoroughly analyze potential factors that may lower product yield and quality. Teseda’s Diagnostic Manager suite of tools provides important information and links to the wafer production and test process:
  • Identify the physical location of an electrical test failure
  • Provide the logical information for a suspect Inspection defect
  • Rapidly determine systemic defects from random defects
  • Analyze which defects have the largest impact on yield
Whether you collect the data from Teseda’s V5xx series of Validation and Failure Analysis platforms, your own ATE, or various inspection equipment, the DM Suite can be adapted to work with your data and integrate into your environment.
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