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ScanXY™, The first
product in the Teseda Diagnostic Manager™ series, quickly links
structural test mismatch data to its physical domain for rapid analysis
and diagnosis of defects and hot spots.
The
incorporation of scan-based testing drives the need for scan-based
diagnostic software provided in the Teseda Diagnostic Manager™
Series. ScanXY™ bridges design, test,
manufacturing and failure analysis by providing the logical to physical
correlation using the benefit of your scan architecture.
Graphically view physical
locations of mismatches
ScanXY™ interprets
physical design information and failure files and highlights reported
mismatches of failed test results to the capturing scan cell in a
physical XY location on the die. No other third party tools are
required to view and analyze results.
Immediately begin yield learning with single
or stacked results on volumes of failing structural test data from
multiple devices or die on a wafer. ScanXY™ is
integrated with the Teseda WorkBench™
so it easily imports results from the Teseda V500™ Series
platforms or any ATE hosting the TWB. Also available in stand alone to
read in EDA or ATE failure files formatted from your test database or
ATE.
Determine the
mismatching scan
cell based on pattern
Teseda’s ScanXY™
with its easy-to-use graphical user interface with point-and-click
commands lends itself well to design, test, production and failure
analysis engineers. ScanXY™ is integrated into
the Teseda TWB™ environment or can be used stand alone for any
diagnosis environment. Hardware platform and test software independent,
ScanXY™ can be
customized to support any failure file formats.
Click here
to request a printed ScanXY™ Datasheet.
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